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Assembling process¿¡¼­ solder flow¸¦ ¹æÁö
PCBÀÇ bow & twist ¹ß»ý ¹× conductor space¸¦ ÃæÁøÇÔÀ¸·Î½á assembling process¿¡¼­ defect rateÀ» °¨¼Ò
´ÙÃþ Èĸ· copper PCB¿¡¼­ À¯ÀüüÃþ µÎ²²¸¦ °¨¼Ò

Ç׸ñ
´ÜÀ§
TG-5000
TG-6000
ºñ°í
ÀÏ¹Ý Æ¯¼º
º£À̽º ¼öÁö
-
Epoxy resin Modified
-
Çü»ó
-
Green Liquid
-
Á¡µµ
cps, at20¡É
22,000
45,000
BH type Viscometer
¹Ðµµ
at25¡É
2.42
1.38
-
Èֹߵµ
wt%
non
-
ÀÛ¾÷ Á¶°Ç
È¥ÇÕºñ
wt%
One packed type
-
°ÖŸÀÓ
at160¡É,
min' sec"
60"
2' 30"
1cc Scale
°¡»ç½Ã°£
at5¡É, Day
< 90
-
°æÈ­Á¶°Ç
-
150¡ÉX 2hr
Oven
À¯¸®ÀüÀ̿µµ
¡É
68
195
DMA
°æÈ­ ÈÄ ¹°¼º
ÀÎÀå°­µµ
kg/cm2
420
640
-
Á¢Âø
kg/cm2
125
107
JIS-6911
°æµµ
Shore-D
81
92
JIS-6911
Dielectric constant
50Hz
3.1
3.1
JIS-6911
üÀû ÀúÇ×
¥Øcm
3.85¡¿1015
5.3¡¿1015
JIS-6911
¼öºÐ Èí¼ö
(%)
20¡É,5Day
0.09

0.08

-
80¡É, 5hr
0.18
0.16
¼± ÆØâ °è¼ö
X 10-6 1/K
21
18
TMA
UL
-
V-0
V-0
-
¿ë¸Å ÀúÇ×¼º
À̼ÒÇÁ·ÎÆÇ¿Ã
-
passed
passed
IPC-SM-840C, 3.6.1
À̼ÒÇÁ·ÎÆÇ¿Ã(75%)
¹°(25%)
-
passed
passed
m-ethanolamine
-
passed
passed
Deionized H2O
-
passed
passed

 



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